M+ RUGGED

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DESIGNED TO OPERATE WHERE COMMERCIAL STORAGE DOESN'T

MEMKOR storage platforms are available with extended-temperature components and application-specific ruggedization for demanding deployed environments.

Depending on the product and configuration, MEMKOR solutions support operating temperatures down to -55°C and up to +105°C, vibration levels up to 30 gRMS, and shock up to 100G / 11 ms.

-55°C TO +105°C | UP TO 30 gRMS vibration | UP TO 100G 11 ms shock

*Capabilities vary by product and configuration.

RELIABILITY STARTS AT THE PCB

A rugged SSD must maintain electrical and mechanical integrity throughout the operating environment.

MEMKOR can apply multiple layers of ruggedization depending on the application:

• Extended-Temperature Components
  Select components for operation across the required temperature range.
• Conformal Coating
  Protect PCB assemblies against moisture, contamination, and environmental exposure. Options include Urethane, Acrylic, and Parylene.
• Underfill + Mechanical Reinforcement
  Improve component retention and mechanical reliability under shock, vibration, and thermal cycling.
• Application-Specific Mechanical Design
  Adapt enclosures, mounting, retention, heat transfer, and interfaces around the platform environment.
• Locked Bill of Material
  Maintain component and configuration control after qualification.

THE REQUIRED ENVIRONMENT DEFINES THE LEVEL OF RUGGEDIZATION

THE SSD PERFORMS IN THE ENVIRONMENT. THE CONNECTOR MUST TOO.

Standard SATA and PCIe connectors can become a mechanical weak point in high-vibration or frequently serviced systems.

MEMKOR offers rugged connector options that maintain the standard SATA footprint while significantly increasing vibration capability and mating-cycle life.

AMPHENOL HIVIBE

30+ gRMS | 20,000+ Mating Cycles | Standard SATA Footprint

Developed with Amphenol Aerospace using Micro-Hyperboloid contact technology, HiVibe provides a drop-in rugged alternative to conventional SATA connectivity while maintaining the standard SATA footprint. It enables significantly greater vibration resistance and mating-cycle life without requiring adapter boards or major system redesign.

SMITHS INTERCONNECT NEBULA

30+ gRMS | 100,000+ Mating Cycles | Standard SATA Footprint

NEBULA uses hyperboloid contact technology to maintain reliable electrical connectivity under demanding vibration, shock, and repeated insertion/removal cycles. Its very high mating-cycle capability makes it especially well suited for removable, serviceable, and frequently accessed storage applications.

MIL-DTL-38999 

For external and distributed storage architectures such as FRED, MEMKOR supports multiple MIL-DTL-38999 connector configurations for rugged power and data connectivity. Connector selection can be tailored to the interface, environmental requirements, mounting architecture, and serviceability needs of the platform.

CUSTOM CONNECTIVITY

If your engineering team has a preferred connector or interface requirement, MEMKOR can evaluate integration into existing or custom storage form factors. Options can include application-specific connector placement, pinout, cabling, retention, and mechanical integration.

HiVibe | NEBULA | MIL-DTL-38999 | Custom Connector Integration

BUILT FOR HIGH-RELIABILITY APPLICATIONS

MEMKOR storage is available with PCBs manufactured to IPC-6012 Class 3 requirements and assemblies built to IPC-A-610 Class 3 requirements for high-reliability Defense and Aerospace applications.

Building to Class 3 means applying tighter fabrication, workmanship, inspection, and acceptance criteria than standard commercial assemblies.

WHAT IS IPC CLASS 3?

IPC defines three classes of electronic products:

• Class 1: General use electronics, where function is the primary requirement (e.g., consumer gadgets).
• Class 2: Dedicated service electronics, where extended life and consistent performance matter, but some downtime is acceptable (e.g., industrial equipment).
• Class 3: High-performance, harsh-environment electronics, where uninterrupted service and long-term reliability are critical. Examples include avionics, satellites, defense systems, and medical life-support.

Class 3 is the gold standard, requiring the tightest tolerances, the most stringent inspection criteria, and the highest workmanship standards in the industry.

KEY IPC CLASS 3 REQUIREMENTS

• Annular Ring Integrity
  Tighter requirements around copper remaining between a drilled hole and surrounding pad help maintain reliable electrical and mechanical connections through plated vias and through-holes.
• Plated Through-Hole Quality
  Class 3 imposes stricter requirements for hole-wall plating, copper thickness, continuity, and workmanship to improve long-term interconnect reliability.
• Solder Joint Workmanship
  Tighter acceptance criteria are applied to solder fillets, wetting, voiding, component termination, and other assembly characteristics that can affect long-term reliability.
• Material + Process Control
  Controlled PCB materials, surface finishes, solder masks, assembly processes, and workmanship help improve consistency across production builds.
• Enhanced Inspection + Verification
  Class 3 manufacturing can require more rigorous visual inspection, microsection analysis, electrical testing, and documented process control to verify conformance.

WHY CLASS 3 MATTERS

For airborne, ground, naval, and other high-reliability Defense + Aerospace applications, Class 3 manufacturing helps reduce risk at the board and assembly level.

• HIGHER WORKMANSHIP STANDARDS
  Tighter fabrication and assembly requirements reduce acceptance of marginal conditions that may be permitted in lower classes.
• IMPROVED INTERCONNECT RELIABILITY
  More stringent requirements for vias, plated through-holes, solder joints, and PCB construction help support long service life.
• GREATER CONFIGURATION CONFIDENCE
  Defined manufacturing criteria and inspection requirements provide greater consistency across qualified production hardware.
• REDUCED PROGRAM RISK
  Stricter manufacturing and inspection controls can help reduce latent defects and field failures over the life of the program.

CLASS 3 IS ONE PART OF RUGGEDIZATION

IPC Class 3 defines manufacturing and workmanship requirements. It does not by itself establish shock, vibration, or temperature performance.

Environmental capability comes from the complete storage architecture, including:

Component Selection | PCB Design | Mechanical Reinforcement | Conformal Coating | Underfill | Rugged Connectors | Thermal Design | Environmental Testing

AVAILABLE FOR STANDARD + CUSTOM STORAGE ARCHITECTURES

IPC Class 3 manufacturing can be incorporated into selected MEMKOR SSD, embedded, and custom storage configurations based on program requirements.

QUALIFY THE STORAGE WHERE IT WILL OPERATE

Datasheet performance at room temperature tells only part of the story.

Temperature can affect NAND behavior, controller performance, error correction, thermal throttling, retention, and sustained throughput. Shock and vibration can expose mechanical weaknesses that never appear on a bench.

MEMKOR production and qualification testing can include:

Extended-Temperature Operation | Burn-In | Shock | Vibration | Functional Testing | Application-Specific Environmental Testing

For selected product families, every production unit undergoes extended-temperature testing and 12–48 hours of burn-in at MEMKOR headquarters before shipment.

DON'T JUST COMPARE DATASHEETS

Evaluate storage under the temperatures, workloads, and mechanical conditions your platform will actually experience.

NOT EVERY PLATFORM NEEDS THE SAME SOLUTION

TANGERINE SERIES | PERFORMANCE + CAPACITY

For data-intensive platforms that prioritize high performance and capacity while still requiring industrial-temperature operation, lifecycle control, and Defense + Aerospace reliability. Available across PCIe/NVMe and SATA architectures for applications where throughput and storage density are the primary drivers.

ORANGE SERIES | CONFIGURABLE RUGGEDIZATION

For platforms requiring I-temp operation, conformal coating, rugged connectors, high-endurance NAND, and other configurable environmental features without maximum BLACK-level ruggedization.

BLACK SERIES | EXTREME RUGGEDIZATION

For applications requiring expanded temperature capability, up to 30 gRMS vibration, high shock, enhanced mechanical reinforcement, and rugged SATA connectivity.

FRED | RUGGED EXTERNAL STORAGE

For applications where storage must be mounted outside the compute enclosure or positioned closer to sensors, payloads, or accessible service locations.

3U VPX + XMC | CONDUCTION-COOLED EMBEDDED STORAGE

For embedded systems requiring rugged storage integrated directly into VPX architectures and compatible SBCs.

RUGGEDIZATION MUST MATCH THE REQUIREMENT.

MEMKOR works directly with your engineering team to understand the platform environment and configure the appropriate combination of:

Temperature Range | Shock | Vibration | PCB Construction | Component Selection | Conformal Coating | Underfill | Connector | Mechanical Design | Thermal Management | Testing

Whether the requirement is a modified standard SSD or a fully integrated VPX, XMC, FRED, or custom storage architecture, ruggedization starts with your actual application.

THE REQUIRED ENVIRONMENT DEFINES THE LEVEL OF RUGGEDIZATION

EVERYTHING STARTS WITH YOUR OPERATING ENVIRONMENT

Contact our MEMKOR Engineering Team