M+ DESIGN

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THE APPLICATION DEFINES THE STORAGE

The right storage architecture depends on much more than capacity and interface.

MEMKOR evaluates the requirements that drive the design:

• Workload + Data Rate
  Sequential or random access, sustained write performance, read/write ratio, duty cycle, and mission-data volume.
• Capacity + Endurance
  NAND technology, P/E cycle requirements, over-provisioning, expected writes, and mission life.
• Operating Environment
  Temperature, shock, vibration, altitude, humidity, contamination, and thermal cycling.
• SWaP
  Available board area, enclosure volume, power, cooling, weight, VPX slots, cabling, and mounting constraints.
• Security
  Encryption, SED management, Write Protect, Secure Erase, zeroization, and program-specific security requirements.
• Lifecycle
  Configuration control, qualification, obsolescence management, and long-term production support.

ONE SIZE DOES NOT FIT ALL

Everything starts with your application

OPTIMIZE THE BUILD AROUND THE MISSION

MEMKOR can tailor component selection and manufacturing processes around the environmental and performance requirements of the system.

Available design options include:

• Component Selection
  ndustrial- and defense-grade components can be selected for temperature range, reliability, endurance, lifecycle, and operating environment.
• IPC Class 2 + IPC Class 3
  Assemblies can be configured for IPC Class 2 or Class 3 manufacturing requirements depending on the reliability and program requirements of the application.
• Tin-Whisker Mitigation
  Material and process controls can be applied to reduce tin-whisker risk in long-life, high-reliability systems.
• Conformal Coating
  Conformal coating options, including arcylic, urethan, and parylene, can provide additional protection against moisture, contamination, and environmental exposure
• High-Cycle Connectivity
  Increased gold plating and rugged connector options can be used for applications requiring frequent insertion and removal or operation under high vibration.

DESIGN FOR SUSTAINED OPERATION

Storage performance, NAND behavior, and controller reliability are all influenced by environmental temperature.

MEMKOR can tailor the thermal architecture around the host system and workload using:

Thermal Interface Materials | Gap Fillers | Heat Spreaders | Custom Heat Sinks | Conduction Paths | Enclosure Integration

Thermal interface materials and gap fillers can improve heat transfer between the SSD, enclosure, chassis, or host system, while application-specific mechanical designs can create more effective conduction paths.

PEAK PERFORMANCE IS ONLY USEFUL IF YOU CAN SUSTAIN IT

Thermal design should be evaluated together with interface speed, workload, power consumption, and operating temperature.

Standard SSD dimensions, connector locations, mounting points, and thermal paths do not always align with Defense and Aerospace system constraints.

MEMKOR can modify existing platforms or develop application-specific storage architectures around the available space, mechanical envelope, cooling approach, interface, and serviceability requirements of the host system.

Custom design options can include:

• Application-Specific PCB Geometry
  Optimize board shape, component placement, and storage density around available system volume.
• Custom Enclosures + Carriers
  Develop rugged mechanical structures for shock, vibration, handling, and environmental exposure.
• Mounting + Retention
  Tailor standoffs, mounting points, retention features, and structural interfaces to the host platform.
• Connector Placement + Pinout
  Configure connector type, location, orientation, pinout, and cabling around the system architecture.
• Thermal Integration
  Design heat spreaders, conduction paths, heat sinks, and enclosure interfaces around the available cooling strategy.
• EMI + Environmental Protection
  Incorporate shielding, conformal coating, sealing, and other protective features where required.
• Vibration Isolation + Mechanical Reinforcement
  Add structural or isolation features for demanding shock and vibration environments.

FROM MODIFIED COTS TO FULLY CUSTOM

Customization can range from a modified standard SSD to a completely application-specific PCB, enclosure, connector, and thermal architecture.

PCB Geometry | Capacity | Interface | Connector | Mounting | Thermal | Enclosure | Security | Ruggedization

HIGH-RELIABILITY MANUFACTURING WHEN THE PROGRAM REQUIRES IT

For applications requiring elevated manufacturing and workmanship, MEMKOR can provide PCBs manufactured to IPC-6012 Class 3 requirements and assemblies built to IPC-A-610 Class 3 requirements.

Class 3 manufacturing applies tighter criteria to areas such as:

Annular Ring Integrity | Plated Through-Holes | Solder Workmanship | Materials + Process Control | Inspection + Verification

IPC Class 3 is one part of the overall reliability architecture and can be combined with environmental ruggedization, enhanced component selection, conformal coating, thermal design, and production testing.

QUALIFY ONCE. CONTROL THE CONFIGURATION

A custom storage solution only provides value if it can be supported throughout the program lifecycle.

MEMKOR combines application-specific engineering with:

Locked BOM | Configuration Control | PCN Management | Obsolescence Management | Qualification Support | Long-Term Production

Once a configuration is qualified, MEMKOR works to maintain that configuration and manage component transitions in a controlled manner.

When a component reaches end-of-life, MEMKOR works with your team to transition to a form, fit, and function-compatible replacement while minimizing redesign, requalification, and impact to the existing system configuration.